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 FDA20N50F N-Channel MOSFET
October 2007
FDA20N50F
N-Channel MOSFET
500V, 22A, 0.26 Features
* RDS(on) = 0.22 ( Typ.) @ VGS = 10V, ID = 11A * Low gate charge ( Typ. 50nC ) * Low Crss ( Typ. 27pF ) * Fast switching * 100% avalanche tested * Improved dv/dt capability * RoHS compliant
UniFETTM
tm
Description
These N-Channel enhancement mode power field effect transistors are produced using Failchild's proprietary, planar stripe, DMOS technology. This advance technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These device are well suited for high efficient switched mode power supplies and active power factor correction.
D
G GDS
TO-3PN
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*
Symbol VDSS VGSS ID IDM EAS IAR EAR dv/dt PD TJ, TSTG TL Parameter Drain to Source Voltage Gate to Source Voltage Drain Current Drain Current Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation - Derate above 25oC (TC = 25oC) -Continuous (TC = 25oC) - Pulsed -Continuous (TC = 100oC) (Note 1) (Note 2) (Note 1) (Note 1) (Note 3) Ratings 500 30 22 13 88 1110 22 39 4.5 388 3.1 -55 to +150 300 Units V V A A mJ A mJ V/ns W W/oC
o o
Operating and Storage Temperature Range Maximum Lead Temperature for Soldering Purpose, 1/8" from Case for 5 Seconds
C C
Thermal Characteristics
Symbol RJC RCS RJA Parameter Thermal Resistance, Junction to Case Thermal Resistance, Case to Sink Thermal Resistance, Junction to Ambient Min. 0.24 Max. 0.44 40
o
Units C/W
(c)2007 Fairchild Semiconductor Corporation FDA20N50F Rev. A
1
www.fairchildsemi.com
FDA20N50F N-Channel MOSFET
Package Marking and Ordering Information
Device Marking FDA20N50F Device FDA20N50F Package TO-3PN Reel Size Tape Width Quantity 30
Electrical Characteristics TC = 25oC unless otherwise noted
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BVDSS BVDSS / TJ IDSS IGSS Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Body Leakage Current ID = 250A, VGS = 0V, TJ = 25oC ID = 250A, Referenced to 25 C VDS = 400V, TC = 125oC VGS = 30V, VDS = 0V VDS = 500V, VGS = 0V
o
500 -
0.6 -
10 100 100
V V/oC A nA
On Characteristics
VGS(th) RDS(on) gFS Gate Threshold Voltage Static Drain to Source On Resistance Forward Transconductance VGS = VDS, ID = 250A VGS = 10V, ID = 11A VDS = 40V, ID = 11A
(Note 4)
3.0 -
0.22 24
5.0 0.26 -
V S
Dynamic Characteristics
Ciss Coss Crss Qg(tot) Qgs Qgd Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge at 10V Gate to Source Gate Charge Gate to Drain "Miller" Charge VDS = 400V, ID = 20A VGS = 10V VDS = 25V, VGS = 0V f = 1MHz (Note 4, 5)
2550 350 27 50 14 20
3390 465 40 65 -
pF pF pF nC nC nC
-
Switching Characteristics
td(on) tr td(off) tf Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time VDD = 250V, ID = 20A RG = 25
(Note 4, 5)
-
45 120 100 60
100 250 210 130
ns ns ns ns
Drain-Source Diode Characteristics
IS ISM VSD trr Qrr Maximum Continuous Drain to Source Diode Forward Current Maximum Pulsed Drain to Source Diode Forward Current Drain to Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, ISD = 22A VGS = 0V, ISD = 20A dIF/dt = 100A/s
(Note 4)
-
154 0.5
22 88 1.5 -
A A V ns C
Notes: 1: Repetitive Rating: Pulse width limited by maximum junction temperature 2: L = 5mH, IAS = 20A, VDD = 50V, RG = 25, Starting TJ = 25C 3: ISD 22A, di/dt 200A/s, VDD BVDSS, Starting TJ = 25C 4: Pulse Test: Pulse width 300s, Duty Cycle 2% 5: Essentially Independent of Operating Temperature Typical Characteristics
FDA20N50F Rev. A
2
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FDA20N50F N-Channel MOSFET
Typical Performance Characteristics
Figure 1. On-Region Characteristics
80
VGS = 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V 5.5 V
Figure 2. Transfer Characteristics
100
ID,Drain Current[A]
10
ID,Drain Current[A]
10
150 C 25 C
o
o
1
0.5 0.1
*Notes: 1. 250s Pulse Test 2. TC = 25 C
o
1 VDS,Drain-Source Voltage[V]
10
1
*Notes: 1. VDS = 20V 2. 250s Pulse Test
4
6 VGS,Gate-Source Voltage[V]
8
Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage
0.8 0.7
RDS(ON) [], Drain-Source On-Resistance
Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature
100
0.6 0.5 0.4 0.3 0.2 0.1
*Note: TJ = 25 C
o
IS, Reverse Drain Current [A]
10
150 C 25 C
o
o
VGS = 10V VGS = 20V
1
*Notes: 1. VGS = 0V
0
25 50 ID, Drain Current [A]
75
0.2 0.0
2. 250s Pulse Test
0.5 1.0 VSD, Body Diode Forward Voltage [V]
1.5
Figure 5. Capacitance Characteristics
6000
Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd
Figure 6. Gate Charge Characteristics
10
VGS, Gate-Source Voltage [V]
VDS = 100V VDS = 250V VDS = 400V
4500
Capacitances [pF]
Coss *Note: 1. VGS = 0V 2. f = 1MHz Ciss
8
6
3000
4
1500
Crss
2
*Note: ID = 20A
0 0.1
1 10 VDS, Drain-Source Voltage [V]
50
0
0
10
20 30 40 50 Qg, Total Gate Charge [nC]
60
FDA20N50F Rev. A
3
www.fairchildsemi.com
FDA20N50F N-Channel MOSFET
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation vs. Temperature
1.2 BVDSS, [Normalized] Drain-Source Breakdown Voltage
Figure 8. Maximum Safe Operating Area
200
100
1.1
ID, Drain Current [A]
100s
30s
10
Operation in This Area is Limited by R DS(on)
1ms 10ms DC
1.0
1
0.9
*Notes: 1. VGS = 0V 2. ID = 250A
*Notes: 1. TC = 25 C 2. TJ = 150 C 3. Single Pulse
o o
0.8 -100
0.1
-50 0 50 100 150 o TJ, Junction Temperature [ C]
200
1
10 100 VDS, Drain-Source Voltage [V]
1000
Figure 9. Maximum Drain Current vs. Case Temperature
25
20
ID, Drain Current [A]
15
10
5
0 25
50 75 100 125 o TC, Case Temperature [ C]
150
Figure 10. Transient Thermal Response Curve
1
Thermal Response [ZJC]
0.5
0.1
0.2 0.1 0.05
PDM t1 t2
o
0.01
0.02 0.01 Single pulse
*Notes: 1. ZJC(t) = 0.44 C/W Max. 2. Duty Factor, D=t1/t2 3. TJM - TC = PDM * ZJC(t)
1E-3 -5 10
10
-4
10 10 Rectangular Pulse Duration [sec]
-3
-2
10
-1
10
0
FDA20N50F Rev. A
4
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FDA20N50F N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDA20N50F Rev. A
5
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FDA20N50F N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
+ V
DS
_ I
SD
L D r iv e r R
G
S am e T ype as DUT
V
DD
V
GS
* d v / d t c o n t r o lle d b y R G * I S D c o n t r o lle d b y p u ls e p e r io d
V GS ( D r iv e r )
G a t e P u ls e W id th D = -------------------------G a te P u ls e P e r io d
10V
I F M , B o d y D io d e F o r w a r d C u r r e n t
I SD (DUT ) IR M
d i/ d t
B o d y D io d e R e v e r s e C u r r e n t
V DS (DUT )
B o d y D io d e R e c o v e r y d v / d t
V
SD
V
DD
B o d y D io d e F o r w a r d V o lt a g e D r o p
FDA20N50F Rev. A
6
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FDA20N50F N-Channel MOSFET
Mechanical Dimensions
TO-3PN
FDA20N50F Rev. A
7
www.fairchildsemi.com
FDA20N50F N-Channel MOSFET
TRADEMARKS
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx(R) Build it NowTM CorePLUSTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R)
(R)
Fairchild(R) Fairchild Semiconductor(R) FACT Quiet SeriesTM FACT(R) FAST(R) FastvCoreTM FPSTM FRFET(R) Global Power ResourceSM
Green FPSTM Green FPSTM e-SeriesTM GTOTM i-LoTM IntelliMAXTM ISOPLANARTM MegaBuckTM MICROCOUPLERTM MicroFETTM MicroPakTM MillerDriveTM Motion-SPMTM OPTOLOGIC(R) OPTOPLANAR(R)
(R)
PDP-SPMTM Power220(R)
Power247(R) POWEREDGE(R) Power-SPMTM PowerTrench(R) Programmable Active DroopTM QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM SMART STARTTM SPM(R) STEALTHTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6
SuperSOTTM-8 SyncFETTM The Power Franchise(R)
TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TinyPowerTM TinyPWMTM TinyWireTM SerDesTM UHC(R) UniFETTM VCXTM
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only
Rev. I31
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
FDA20N50F Rev. A
8
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